Part-Time Programs in Engineering and Applied Science, Johns Hopkins University

Introduction to Electronic Packaging
525.407

Course Description
Topics include fundamentals of electronic packaging engineering and basic concepts in thermal, mechanical, electrical, and environmental management of modern electronic systems. Emphasis is on high-frequency (and high-speed) package performance and its achievement through the use of advanced analytical tools, proper materials selection, and efficient computer-aided design. Packaging topics include die and lead attachment, substrates, hybrids, surface-mount technology, chip and board environmental protection, connectors, harnesses, and printed and embedded wiring boards.

Syllabus

  1. Introduction-Packaging Hierarchy, Why Package?
  2. Fundamentals-Chip to System, Package Styles
  3. Packaging Economics- Cost Principles,LCC, ROI
  4. Package Design-System Concepts, Partitioning
  5. Package Design-Design Tools, Materials Selection
  6. Package Design-Thermal,CTE
  7. Package Design-Electrical, Impedance
  8. Board&Substrate Systems-Multichip Modules
  9. Level 1 Interconnect-Wirebonding,TAB,Flip Chip
  10. Level 2&3 Interconnect-Thru Hole Vs SMT
  11. Reliability-Models, Accelerated Testing
  12. Course Examination
  13. Environmental Protection-Methods, Qualification
  14. Case Studies-Packaging for Various Applications

Prerequisites
An undergraduate degree in a scientific or engineering area, including familiarity with computer-aided design and engineering analysis methods for electronic circuits and systems.

Instructor
Harry K. Charles, Jr. is the Assistant Department Head for Engineering in the Technical Services Department at the Johns Hopkins University Applied Physics Laboratory (APL). Dr. Charles is a member of the Principal Professional Staff at APL and is a specialist in solid state physics, semiconductor devices, electronic materials and packaging. He is a fellow of both the IEEE and the International Microelectronics and Packaging Society.

Computer Lab Requirements
No specific computer requirements are necessary for this course.

Textbook
Microelectronics Packaging Handbook by R.R. Tummala, E.J. Rymaszewski, and A.G. Klopfenstein

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updated May 1999